TIN / LEAD SOLDER PLATE

Keystone Tin / Lead electrodeposited plating offers exceptional coverage, excellent solderability ,ductility and has a relatively pore-free deposit. We have facilities for Tin / Plating plating both small and large parts in various sized barrels, racks and wiring. 

Used primarily as a base for soldering protection and as a coating for corrosion protection, Tin / Lead baths are composed of tin & lead fluoborates. Without the use of proprietary brighteners the finish will be matte. Flow brightened or re-flowed matte tin lead plated parts are most commonly used on printed circuitry parts and components because they lack voids, bubbles and other poor adhesion characteristics.

Tin / Lead Solder Plating Specification

• Specification: MIL-P-81728 or AMS-P-81728

Tin / Lead Solder Plating Thickness by Application

• Non-Electric Components                .0003" to .0005" unless otherwise specified
• Electronic Components                    Flash to .0003"  

• 60/40 melting point range is 361°- 374°F
• 90/10 melting point range is 450°- 464°F
• 95/5 melting point range is 452°- 464°F  

TIN / LEAD SOLDER PLATING PROCESSES

Keystone offers the following processes for Tin / Lead Solder Electroplating:

• Bright
• Matte

TIN / LEAD SOLDER PLATING APPLICATIONS

Keystone Tin / lead electrodeposited coatings have proved invaluable in countless applications. Some traditional uses of Keystone Tin / lead electrodeposited coatings include:

• Electronics
• Military
• Aerospace
• Communications
• Manufacturing